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Perspective: S – ALD

24 December 2023, 08:59 David Evans
min read Guides
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Spatial Atomic Layer Deposition

Image: Thin film semiconductor wafer (L); Cross-sectional scanning electron microscope image of an Al2O3 ALD film with a thickness of 300 nm on a silicon wafer with a trench structure (R)

Thin films and specialised coatings have been the enabling technology for many ground-breaking innovations in modern life, including OLED screens, solar cells and battery technology. To make these products more efficient, expand their lifetime, or miniaturise them further, it is important that the thin film that is incorporated in the product, or is covering the product, is of a consistent and high quality. The deposition of thin films also has to happen at a sufficiently high rate to enable economically viable production at a cost price which can facilitate wide-scale adoption. Current technology has to trade-off high production throughput with high quality and conformity of the film.

Solving this has the ability to unlock transformational applications in several next generation innovations such as:

  1. Energy storage: Next generation solid state lithium batteries (with potentially 3x the lifespan, 3x the energy density and 1/6 the charge time of current cells)
  2. Flexible electronics: Thin film coatings can coat flexible substrates such as flexible OLED displays, wearable electronics and bendable sensors that can be used in various applications such as foldable phones, wearables and car windscreens.
  3. Solar power: Coatings for next generation solar cells such as perovskite solar cells that offer a step change in efficiency, cost and applications (a perovskite tandem cell offers a theoretical efficiency limit of 43% vs 29% for silicon cells)
  4. Barrier coating in packaging: Barrier coatings such as ultra-thin moisture barrier coating in recyclable food and beverage packaging, eliminating plastics and widening the application of carton packaging.
  5. Biomedical applications: Thin film biocompatible coatings on medical implants, devices, and diagnostic tools can enhance biocompatibility, reduce friction, and prevent bacterial adhesion, resulting in improved patient outcomes and device longevity.
  6. Optical coatings: Thin film coatings can be used in anti-reflective coatings, optical filters, and mirrors for applications in optics, photonics, and solar panels.
  7. Semiconductors: Thin, uniform coatings on packaging materials used in the semiconductor industry. These coatings can improve moisture resistance, thermal stability, and adhesion, enhancing the reliability and performance of semiconductor devices.
There are several technologies available currently to make barrier films. The highest quality films currently viable in commercial use for coatings and barrier films is produced using the CVD (Chemical Vapor Deposition) technique, a process whereby the coating is achieved on a substrate through a reaction between the substrate and a mix of gases in a chamber. This technology is however high cost, energy intensive, requires high temperatures (resulting in substrate deformation), can suffer from non-uniform deposition with variations in thickness and performance, and does not work for all types of film.
 
ALD (Atomic Layer Deposition) has the potential to be a far superior method, whereby the barrier film is built up, or grown, atom-by-atom through successive flushing of gases. ALD produces very thin films with a high degree of control of the thickness and composition of the films possible at the atomic level. However, ALD is currently not commercially feasible in wide-scale applications. ALD is difficult to do in mass production as the current technology allows for only wafers to be coated (i.e. slates/tiles) in a batch process. Commercial applications require high volumes of thin film in a continuous process in rolls, which CVD and other technologies can do. Spatial ALD is a concept by which rolls of thin film are produced using the ALD method, provides a superior function solution to CVD in quality, at a competitive price.

Spatial ALD (SALD) as a concept has however been stuck in laboratories and research departments as parties have not yet been able to solve how to build a machine that can process high volumes of film on a constant basis. There has been some early piloted commercial progress in Spatial ALD, but such machines are currently not able to produce at a high enough speed to be commercially feasible and suffer from cross-contamination requiring frequent stoppages. The throughput speed of Spatial ALD machines has a significant cost impact per square meter as the cost of the machines are high and a significant component in production cost. As such, there has not been a mass adoption of Spatial ALD to date.

Solving Spatial ALD in a continuous process is a key technology with tremendous commercial impact in unlocking transformational innovation in a range of industries across electronics, energy storage, packaging and healthcare.

The Netherlands is a critical global hub for research and development in this space, with technology development hubs in Eindhoven and Delft supported by the universities and state-backed research institutes and regional development funds, and skills highly related to the success that ASML has fostered in the region.

At the end of 2023 we signed a term sheet to lead a strong consortium of investors into a promising early-stage startup that has developed machinery and IP that has the potential to solve Spatial ALD in a continuous process. This has the potential to lower the cost of thin films to around 1/20th of current technology, while dramatically improving their functional performance and consequently hugely expanding their application. We are exceptionally excited about the future potential of this transformative technology.

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